Hello,
I am looking for a power management solution for my uC board that has a 3.7 V LiPo power supply. I need a 3.3 V output with a max current draw of 500 mA, and a battery gauge, as well as a USB battery charging solution.
Looking at the TI family, this would mean 3 separate ICs, as far as I understand. I'd appreciate any recommendations for the above application.
Regards
Hello.
My customer is currently in use TPS62110, I have gotten a question about this product .
So , I have a question about TPS62110.
<Question>
What is the minimum and the maximum value of the reference voltage in this product ?
※In the data sheet , it has become the provisions of the typical value (1.153V) only .
Could you help us?
Best Regards,
Masumi Sekiguchi
Hi,
Could you tell me about TPS62170 inverting buck-boost topology?
Our customer would like to use TPS62170 at the following application note conditions.
SLVA469C
www.tij.co.jp/.../slva469c.pdf
In that situation, Customers want to calculate the ILIMF_HS.
Data sheet Page 15,16 shows the following formula.
May I just use this expression?
Please tell me the part to change for buck boost.
Best Regards,
Yusuke/Japan Disty
Howdy,
Working on a design to utilize the TPS62162DSGR step-down regulator and am new to the switching power supplies. I've been looking through the datasheet and have found great info about selecting the right type of capacitor and inductors. They mention paying special attention to areas like ESR, voltage rating, and footprint. I know which values to use for the my application based on an application note (2.2uH and 22uF) but cannot find info on the best footprint. Can't find a dev. kit or evaluation board to reference a BoM either.
Quesiton: Do they have any recommended part numbers?
http://www.ti.com/lit/an/slva463a/slva463a.pdf //app note
http://www.ti.com/product/tps62162
Regards,
Hi,
I am testing out the TLV62130 to potentially be used in our new product.
However, every time a short-circuit is produced across the TLV62130 output (i.e. not the MCP1727), the TLV62130 is damaged (the failure mode is typically either a very low voltage (~250mV, when set to 5V) or erratic output waveform).
There are expected small sparks when short circuiting the output, but I wouldn't imagine this to be the cause of the damage.
We had planned to use the TLV62130 along with a MCP1727 LDO, so I included both here for completeness.
We currently are using a 6 ohm dummy load on the output.
Is there any way to prevent the short-circuit damage?
Much appreciated!!!
Justin
I am using TLV62130 in a consumer product to charge a Li-Ion battery from a USB input. The only overvoltage protection I have on VBUS is TPD4S012.
USB's VBUS is connected to TLV62130 without further overvoltage protection.
If VBUS were subjected to high voltage, TPD4S012 would camp it until it burnt up. I assume TPD4S012 would fail open in such a scenario. TLV62130 would be subjected to PVIN > 20V, which is its rated absolute max. Would TLV62130 fail open? Or would it fail in such a way there is a path from PVIN to PGND and/or to SW? A path from PVIN to PGND would result in TLV62130 getting hot (depending on its restance and the internal resistance of the VBUS supply). A path to SW would trip our battery protection.
The main thing I'm asking is what weird things might TLV62130 do if we exceed its rated PVIN voltage.
Hi All,
I need a 12 to 5 volt converter @3A max, for which the TPS563210 is perfect, but I'd like it to keep delivering about 200mA from a 2 cell Li-Ion battery if the mains fails. The datasheet recommends Vin be > Vo/0.65, or >7.7volts. Does anyone know if the 2 cell supply will work? It's close, but does exceed the duty cycle max recommended. The low output current when on battery should help ... but?
Thanks, Brian
Happy birthday to micro system-in-package (MicroSiPTM)! TI announced this very innovative power-supply solution for exceptionally space-constrained applications (such as personal electronics devices) five years ago this month. The initial TPS82671 fully integrated step-down converter module opened the way for a whole series of devices that incorporate all required passives into a tiny 2.3mm-by-2.9mm package. You don’t need to add an input capacitor, output capacitor, power inductor or feedback resistors; everything’s already there! Figure 1 shows the MicroSiP device.
Figure 1: The MicroSiP device includes all required components
The ability to co-design both the integrated semiconductor IC and the mechanical substrate enables TI to provide industry-leading power densities in the 1.6A TPS8268180 (435W/cm3) family and the 3A TPS82085 (1370W/cm3) families. The TPS8268180 provides the highest current in the smallest size with low noise for communications equipment such as optical modules. Especially in optical modules, saving any printed circuit board (PCB) space with a module-based power supply enables adding extra channels or throughput to the whole system—an immediate product selling advantage is realized. The input-voltage range now accommodates 5V sources for even more flexibility in numerous industrial systems.
Most recently, the 3A MicroSiL-packaged TPS82085 enables the highest power densities for solid-state drives (SSDs) and test and measurement equipment. This industrial-friendly package is mounted like a quad-flat-no-lead (QFN) package instead of the previous bumps of the MicroSiP. Integrating just the IC and power inductor, MicroSiL enables high currents in an approximate 35mm2 total solution size. For SSDs, such a small power supply relinquishes more room for memory, which is what the end customer buys the SSD for.
And don’t forget the innovative TPS82740 for wearable and medical device applications. While it won’t win any awards for power density (it’s only a 200mA device), it could certainly win an award for the most critical functionality packed into 6.7mm2. Just think of what you can accomplish with all components for the entire power solution, 360nA IQ for high efficiency down to loads under 10µA, a load switch for removing critical microamperes of leakage from the battery, an RF-optimized power-save mode to directly power the radio without a linear regulator and more.
No matter your application, there is likely a MicroSiP waiting to shrink your solution size and ease your design effort. Find it here.
Additional resources
Hi
I have a question for a capacitor between AVIN and AGND.
On TPS62130AEVM, there is a capacitor between AVIN-AGND(C7),
However there is no capacitor between AVIN-AGND on TPS62140AEVM.
What is this capacitor for?
Regards,
Koji Hamamoto
Hi,
My application uses USB 2.0 as input into my system. System loads are 3.3V @ 1A and 5V @ 2A. So I will need to use two TPS82084s . Please let me know :
Q1. If the USB 5Vin and Vout=5V OK to do with TPS82084 ( as data sheet indicates Vout can be up to Vin).
Q2. If the USB 2.0 spec states 500mA max draw, what would be the ripple current to draw 1A@3.3V and 2A@5V.
Q3. if the TPS82084 is not a good match is the tps542941 a better device?
Thanks
I followed a design on Webench to convert 24 Vdc to 3.3 Vdc.
Schematics is the same but changed the layout a little bit
I am having a serious problem on the highlighted part (24V in), my modules are fried up, I often see a flame. I tested 20 modules, 10 of them are burnt with a flame.
Here are some examples of the modules. Either the highlighted line burns or the IC explodes.
I check by a DMM that there is no short circuit between Vin-Vout-GNDs. I inspected the connections with a microscope that looked fine.
Here is how I test the DC-DC converters. I supply 24V from a PSU, and place 1.8 M ohm resistor between Vout and ground to measure the voltage by an oscilloscope. (I know red should be used for V, not for Ground, it was just closest wire to me)
I suspected flux to reduce the resistance between the Vin - Ground, so I cleaned the boards, but the problem remains.
It seems like the board drawns too much current somehow, does anyone have a guess/idea what could be the problem?
Hi Chris,
I found following thread that discussed about switching frequency of TPS62085.
Now I also found this behavior on EVM, but I can't find such behavior from information in datasheet. From fig.1 in datasheet, I assumed that it should be 2.4MHz at 3A load but it was approx. 1.4MHz with 3.3V input. On the other hand I can see 2.4MHz with 5.0V input. So please explain the mechanism of this switching frequency variation.
Please refer the waveform at 3.3V and 5.0V input I measured.
(Please visit the site to view this file)
Best Regards,
Sonoki / Japan Disty
Hi,
We have been using the TPS63002 for fixed output voltage of 5V and have used the resistor and capacitor values as mentioned in the typical application circuit of the datasheet.
We've have faced these issues often (Unfortunately I couldn’t manage to measure the currents)
Getting an output of around 2 or 3 V instead of 5V OR No output at all at the Vout pin
After placing new ICs, these seemed to work but would fail again with same problems after a few days.
Going by the frequent failures we narrowed down the reason as a thermal one. We think not enough contact between the thermal pad of PCB and the IC was taking place due to hand soldering.
Thanks !
Sowmya
I am using TLV62130 in a consumer product to charge a Li-Ion battery from a USB input. The only overvoltage protection I have on VBUS is TPD4S012.
USB's VBUS is connected to TLV62130 without further overvoltage protection.
If VBUS were subjected to high voltage, TPD4S012 would camp it until it burnt up. I assume TPD4S012 would fail open in such a scenario. TLV62130 would be subjected to PVIN > 20V, which is its rated absolute max. Would TLV62130 fail open? Or would it fail in such a way there is a path from PVIN to PGND and/or to SW? A path from PVIN to PGND would result in TLV62130 getting hot (depending on its restance and the internal resistance of the VBUS supply). A path to SW would trip our battery protection.
The main thing I'm asking is what weird things might TLV62130 do if we exceed its rated PVIN voltage.
Hi
I have a question for a capacitor between AVIN and AGND.
On TPS62130AEVM, there is a capacitor between AVIN-AGND(C7),
However there is no capacitor between AVIN-AGND on TPS62140AEVM.
What is this capacitor for?
Regards,
Koji Hamamoto
Hi,
I would like a confirmation that we can tie the pin MODE / Data pin directly to VIN on the TPS62420. According to the spec, this is an open-drain pin, but the "ACK" should be driven low only if an exact sequence of bits has been send. So I assume that it is OK to connect it directly to VIN if I want to disable the POWER SAVE mode.
Thanks,
Denis
TPS62090 requires 10nF capacitor between CP and CN pin.
I would like to know the required spec for this capacitor.
I think Vin voltage is added to this capacitor, thus voltage rating is required more than Vin voltage.
Is my idea correct?
About capacitance value, What nF is required as actual capacitance value after DC bias?
Best Regards,
Kohei Sasaki
Almost every portable system needs a 3.3V rail. And for those systems powered by single-cell lithium batteries, there is always a question of how to make this rail. Stepping up the battery voltage (which typically varies from 3V to 4.2V) to 5V and then stepping the 5V down to 3.3V causes the power to go through double conversion. The efficiency of two power-conversion steps is the product of the efficiency of each of those steps, so the overall efficiency for the scenario I’ve described is low. For example, if the step-up converter is 90% efficient and the step-down converter is 95% efficient, the overall efficiency is just 85.5%. There must be a better way to generate the 3.3V that wastes less power.
Using the TPS63025 buck-boost converter family provides higher efficiencies in these types of situations. By combining a >95% efficiency step-down converter and a >90% efficient step-up converter, the conversion efficiency is either >95% or >90% based on the battery voltage (see Figure 1). A buck-boost converter does not double-convert the power, but rather operates as a step-down or step-up converter as needed. Efficiency increases, which reduces temperature rise and increases the run time of the battery.
Figure 1: TPS63025 efficiency vs. output current
You can design such a buck-boost converter into almost any portable system. If you are designing a smartphone, a wafer chip-scale (WCSP) package provides the smallest solution size and is easily manufactured in high-density systems. But for industrial equipment such as barcode scanners, you’re not fighting for every square millimeter of printed circuit board (PCB). These types of applications can use a standard quad flat no-lead (QFN)-type package, which has solder fillets and can be visually inspected during manufacturing.
With the new buck-boost converters, the TPS630250 and the TPS63050 family of devices, engineers now have their choice of packages. For the absolute smallest size, the YFF package (WCSP) is preferable, while for less demanding manufacturing requirements, the RNC package (QFN) is available. Either way, these devices provide a 3.3V rail from a single-cell lithium battery with over 90% efficiency – giving engineers more choices and more applications.
What applications do you have which should you not use a WCSP package?
Hi,
I use in my design a DC-DC converter TPS54620, and am interested in testing its current limiting operation in short circuit mode.
My test setup is as follow:
- Creating a short circuit between Vout and GND.
- Placing a DVM (in current mode) between TPS54620 output pin, and short circuit.
- Measuring output voltage during operation via scope.
- Temperature measurement with a thermo-couple measurement device.
Test results are as follow:
- Output current is at 9.4A (steady).
- Output voltage is ~150mV.
- Temperature reached := 94 degree Celsius (after prolong operation).
My questions are:
- Can the output current limit be lowered?
- Why there is no fold-back operation (as shown in the attached - right graph), whereas my unit behaves like the left graph)?
Can you help me with the above?
Thanks,
Refael.
Hi,
We have been using the TPS63002 for fixed output voltage of 5V and have used the resistor and capacitor values as mentioned in the typical application circuit of the datasheet.
We've have faced these issues often (Unfortunately I couldn’t manage to measure the currents)
Getting an output of around 2 or 3 V instead of 5V OR No output at all at the Vout pin
After placing new ICs, these seemed to work but would fail again with same problems after a few days.
Going by the frequent failures we narrowed down the reason as a thermal one. We think not enough contact between the thermal pad of PCB and the IC was taking place due to hand soldering.
Thanks !
Sowmya